HEAT SINK
Heat sinks are used to carry away heat from central processors (CPUs) or
in any electrical/electronic circuit for that matter. CPUs generate a lot of
heat and this needs to be quickly removed since excessive heat has a
detrimental effect on the CPU performance and its life and in extreme cases may
even cause a meltdown. A temperature rise up to 180 deg centigrade can occur in
high-end processors (P4) and microcontrollers.
How it works:
A heat sink works by carrying away the heat either by convection or
radiation. It consists of a good heat conductor like aluminum or copper placed
very near or touching the heat source. The sink has metal fins of thin cross
section to increase the area for heat dissipation. A motor driven fan is also
placed on the top so that it draws the hot air away faster than natural
convection. To avoid metal-to-metal
contact, thermal grease is used as a thin layer between the heat source and the
heat sink.
Selection:
Heat sinks are made of either copper or aluminum alloys. They are
classified based on:
Cooling: Heat sinks can be either air-cooled or liquid-cooled. Air-cooled
heat sinks can be of bonded fin type, extruded or copper and liquid-cooled heat
sinks can be of liquid-cooled plates or cold plates.
Mounting: Heat sinks can be of board level type or fan assemblies.
The basic criteria are:
Applications:
Heat sinks are used in computers, laptops, semiconductor devices,
microcontrollers, etc.
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