HEAT SINK

 

Heat sinks are used to carry away heat from central processors (CPUs) or in any electrical/electronic circuit for that matter. CPUs generate a lot of heat and this needs to be quickly removed since excessive heat has a detrimental effect on the CPU performance and its life and in extreme cases may even cause a meltdown. A temperature rise up to 180 deg centigrade can occur in high-end processors (P4) and microcontrollers.

 

How it works:

A heat sink works by carrying away the heat either by convection or radiation. It consists of a good heat conductor like aluminum or copper placed very near or touching the heat source. The sink has metal fins of thin cross section to increase the area for heat dissipation. A motor driven fan is also placed on the top so that it draws the hot air away faster than natural convection.  To avoid metal-to-metal contact, thermal grease is used as a thin layer between the heat source and the heat sink.

 

Selection:

Heat sinks are made of either copper or aluminum alloys. They are classified based on:

Cooling: Heat sinks can be either air-cooled or liquid-cooled. Air-cooled heat sinks can be of bonded fin type, extruded or copper and liquid-cooled heat sinks can be of liquid-cooled plates or cold plates.

Mounting: Heat sinks can be of board level type or fan assemblies.

The basic criteria are:

 

Applications:

Heat sinks are used in computers, laptops, semiconductor devices, microcontrollers, etc.

 

 

 

 

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