Compliance Parameters

RoHS Compliant:

YES is shown if the manufacturer indicates that the part is RoHS compliant, NO is shown when the manufacturer indicates that the part is not compliant.

RoHS 5 of 6 Compliant:

YES is indicated if the manufacturer indicates that the part is "RoHS 5 of 6 compliant" but is not completely RoHS compliant, due to the non-exempt presence of lead (Pb) in an amount greater than that allowed by the RoHS directive.

RoHS Exemptions:

RoHS exemptions claimed for the part by the manufacturer. Codes used are per IPC-1752. N/A is shown for RoHS compliant parts for which no exemption has been claimed.

Effective Date:

The date the item was released or was made available. (ref IPC-1752)

Alternate Part Recommendation:

The manufacturer's recommended alternate to the part. (ref IPC-1752)

Last Verified Date:

This is the date when the material data for the part was last verified by PartMiner. To the best of our knowledge, the data accurately describes the material content of the part if ordered on this date.

Identification Parameters

Part Code:

This is the text used by the manufacturer to indicate lead-free and/or RoHS compliant/green parts. This code may be included in part numbers or may only be used in the ordering process or as a marking code on the device itself.

Component Mark:

This is a description of the identifier(s) on the component mark used by the manufacturer to indicate that the component is lead-free and/or RoHS compliant/green.

Shipping Mark:

This is a description of the identifier(s) on the shipping materials (label, reel, box, etc.) used by the manufacturer to indicate that the component is lead-free and/or RoHS compliant/green.

Manufacturer's Package Id:

The manufacturer's package id/name/description.

Manufacturing Process Parameters

Moisture Sensitivity Level:

The moisture sensitivity level of the package, as specified by the manufacturer. Permissible values, according to IPC/JEDEC J-STD-020 are 1, 2, 2a, 3, 4, 5, 5a and 6.

Peak Package Temperature (C):

The maximum temperature in degrees C that the part is qualified to withstand during the soldering process.

Max Time at Peak Temperature (s):

The maximum time that the part (package) is qualified to withstand at the Peak Package Temperature.

Max Number of Reflow Cycles:

The maximum permissible number of surface mount assembly or other solder attach processing (including rework) cycles to which the item can be subjected while ensuring assembly reliability at the peak process body temperature and maximum time at peak termperature. This maximum number of cycles may be different than that shown in J-STD-020. (ref IPC-1752)

Terminal Plating / Grid Array Material:

The uppermost homogeneous material in the termination used on the item to make an electrical connection, sometimes referred to as 'Second Level Interconnect.' An example of this would be the plating on the lead frame of a component such as a TSOP integrated circuit device. If applicable, the grid array material is either the material of the Ball Grid Array (BGA) balls or the finish material used on the metallized lands of the land grid array. (ref IPC-1752)

Terminal Base Material:

The base material of the lead frame or the material directly underneath the Terminal Plating. (ref IPC-1752)

Substance Detail Parameters (100% Disclosure)

Total Weight (mg):

The weight, in milligrams, of the component.

Homogeneous Material:

1) Describes the location of the substance within the component, 2) From IPC-1752: Of uniform composition throughout, where a material cannot be mechanically disjointed into different materials. Common values are lead frame, lead finish, bond wire, encapsulation, mold compound, active device, die attach adhesive, etc.

Substance:

One of the substances/materials which comprise the component.

Substance Symbol:

The symbol or symbols from the periodic table of the elements which describe the substance.

Substance CAS Number:

The Chemical Abstract Service registry number of the substance. CAS registry numbers are unique numeric identifiers for elements and chemical compounds.

JIG Level:

Identifies substances that are identified as Level A or Level B substances in JEDEC JIG-101, the Joint Industry Guide on Material Composition Declaration for Electronic Products.

Substance Weight (mg):

The weight, in milligrams, of the substance.

Substance Weight (ppm):

The weight of the substance, in parts-per-million, in comparison to the total weight of the homogeneous material within which the substance exists.

If you have any questions or comments regarding this information, please contact us at: contentsales@partminer.com.

For more information, please contact PartMiner at 1-888-232-0701 (press 2) or email us at rohscompliance@partminer.com

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